Power enhancement of micro thermoelectric generators by micro fluidic heat transfer packaging

Solid-State Sensors, Actuators and Microsystems Conference(2011)

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摘要
This paper reports the design, fabrication and proof of concept of a multilayer fluidic packaging system enabling an increase in the output power performance of micro thermoelectric generators (μTEGs). The complete integration of the fluidic heat transfer system (HTS) with a μTEG is successfully demonstrated. The fabricated μHTS prototypes were tested with respect to their heat transfer resistance and consumed pumping power. A heat transfer resistance of 0.48cm2K/W was achieved with a small pumping power of 3.7mW/cm2. This results in a potential μTEG power output enhancement of 38 times at a heat source temperature of 320K, cold side temperature of 300K and a thermoelectric figure of merit (Z) of 1.1×10-3 K-1.
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关键词
heat transfer,microfluidics,packaging,thermoelectric conversion,micro fluidic heat transfer packaging,micro thermoelectric generators,multilayer fluidic packaging system,power enhancement,thermoelectric power generation,heat transfer resistance,micro fluidic packaging,micro heat transfer systems,manifolds,high temperature superconductor,resistance,thermoelectric power,copper,heat sink,high temperature superconductors,proof of concept,figure of merit,heat sinks
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