Impact of Aluminum Ion Implantation on the Low Frequency Noise Characteristics of Hf-Based High- /Metal Gate pMOSFETs

Electron Device Letters, IEEE(2014)

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摘要
The impact of aluminum ion implantation (Al I/I) on the 1/f noise and random telegraph noise (RTN) characteristics of high-k/metal gate (HK/MG) pMOSFETs is investigated. The Al I/I technology was implemented to tune the effective work function (EWF) of pMOSFETs without increasing the equivalent oxide thickness and complicating the process. The RTN and 1/f noise results showed that irrespective of the implanted dose, the HK/MG devices with Al I/I still exhibit lower slow oxide trap densities for the control device, because the Al filled the defect and formed a thin Al2O3 layer. In addition, for the HK/MG devices with different implanted doses, no significant differences in the trap properties are noted. However, the modulated EWF can be attributed to the Al I/I-induced dipoles at the HfO2/SiO2 interface.
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关键词
1/f noise,MOSFET,aluminium compounds,hafnium compounds,high-k dielectric thin films,ion implantation,semiconductor device noise,silicon compounds,work function,1/f noise,Al2O3,EWF,HfO2-SiO2,effective work function,equivalent oxide thickness,high-k-metal gate pMOSFET,ion implantation,low frequency noise,oxide trap density,random telegraph noise,1/ (f) noise,1/ƒ noise,HK/MG pMOSFETs,Random telegraph noise (RTN),aluminum ion implantation
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