Insight into the S/D engineering by high-resolution imaging and precise probing of 2D-carrier profiles with scanning spreading resistance microscopy

Electron Devices Meeting(2009)

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摘要
For the first time, high-resolution carrier imaging has been carried out on (110)/(100) pFETs and nFETs with scanning spreading resistance microscopy (SSRM). The S/D of (110) pFETs shows less lateral distribution than that of (100), strongly indicating 2D-channeling effect of boron I/I. Direct evidence has been shown that As out-diffusion under NiSi made conductive paths that degrade junction leakage on (110) nFETs. The Si:C influences on S/D profiles are also directly observed. We also succeeded in a full-FIB sample-making for the first time, showing the high potential of SSRM technology for further scaled devices.
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关键词
carbon,carrier density,field effect transistors,optical microscopy,silicon,(110)/(100) nfet,(110)/(100) pfet,2d-carrier profiles,2d-channeling effect,s-d profiles,si:c,full-fib sample-making,high-resolution carrier imaging,lateral distribution,out-diffusion,precise probing,scanning spreading resistance microscopy,source-drain engineering,resistance,doping,microscopy,high resolution
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