Effect Of Copper Surface Roughness On Thermal Conductance Of Copper/Carbon Nanotube Array Interface

Thermal and Thermomechanical Phenomena in Electronic Systems(2012)

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摘要
In this work, we demonstrate a systematic study on the contact conductance of Cu/carbon nanotube array interface and the effective thermal conductivity of carbon nanotube array as a function of out-of-plane root-mean-square surface roughness of copper. The rms roughness of Cu was controlled at 0.005, 0.024, 0.065, and 0.192 mu m, and the carbon nanotube array was bonded to the controlled Cu surface with In. Using phase sensitive thermal reflectance thermometry, we found that the effective thermal conductivity does not affect by the Cu surface roughness while the contact conductance increased from 0.14 MW/m(2)-K to 1.2 MW/m(2)-K as the Cu surface roughness decreased from 0.192 mu m to 0.065 mu m. Such an increasing trend in contact thermal conductance suggests that the scale of target surface roughness is one of the key factors for CNT arrays based TIMs reach to order of 1 MW/m(2)K in thermal conductance.
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关键词
Thermal Interface Materials,Aligned Carbon Nanotube Array,Cu Surface Roughness,Contact Conductance,Effective Thermal Conductivity
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