Low-cost fabrication of optical subassemblies

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions(1997)

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摘要
The optical subassembly is a major contributor to the cost of a fiberoptic computer data link. A technology for low-cost fabrication of optical subassemblies is described, with emphasis on a transmitter subassembly designed for fiber-channel standard operation (266 Mb/s for 2 km; 1063 Mb/s for 500 m). A factor of three cost reduction is achieved by limiting the parts count to only three: a laser or receiver chip packaged in a TO-can, a plastic housing, and a plastic aspheric lens; and by employment of a fast, automated active-alignment and subsequent fixing technique. Key enabling features include the use of precision injection molding of specially chosen plastics, an aspheric lens design which permits wide positional variations in the axial direction, and curing of a fast setting epoxy through the use of RF power. A tool was constructed which produced subassemblies at high yield having satisfactory performance
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packaging,plastic housing,optical subassemblies,fiber-channel standard operation,plastic packaging,data communication,automated active-alignment,transmitter,500 m,assembling,rf power,plastic aspheric lens,yield,parts count,optical fibre communication,transmitter subassembly,to-can,epoxy curing,optical links,fiberoptic computer data link,fixing technique,optical fabrication,positional variations,2 km,low-cost fabrication,optical subassembly,1063 mbit/s,optical transmitters,injection molding,receiver chip,laser chip,lenses,266 mbit/s,precision injection molding,optical computing,fiber lasers,chip
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