Design of aluminum/polyimide stretchable interconnects investigated through in-situ testing

Trento(2015)

引用 2|浏览7
暂无评分
摘要
In this paper, the mechanics of Aluminum/Polyimide stretchable interconnects is investigated in relation to the structural design of the metal conductor. In-situ electron- and laser-scanning microscopy are combined with mechanical testing to perform both morphological and topographical analysis of failure mechanisms at the small scale. An interplay between interface delamination and metal film buckling is observed and connected to the mismatch between the kinematics of the polymer substrate and the meandering metal film. The role of the metal/polymer interface as a constraint to negotiate the aforementioned kinematics mismatch is discussed, suggesting the relevance of interface mechanics characterization in the view of reliable meander design.
更多
查看译文
关键词
aluminium,buckling,conductors (electric),delamination,failure analysis,integrated circuit interconnections,mechanical testing,metallic thin films,aforementioned kinematics mismatch,aluminum-polyimide stretchable interconnects,electron scanning microscopy,failure mechanisms,in-situ testing,interface delamination,interface mechanics characterization,laser scanning microscopy,meandering metal film,metal conductor,metal film buckling,metal-polymer interface,morphological analysis,polymer substrate,structural design,topographical analysis,stretchable electronics,thin-film buckling,metals,polymers,films,kinematics,strain
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要