Embedded Planar EBG and Shorting Via Arrays for SSN Suppression in Multilayer PCBs

Antennas and Wireless Propagation Letters, IEEE(2012)

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摘要
This letter presents a comprehensive investigation of the low-frequency performance of planar electromagnetic band-gap (PEBG) structures embedded between two shorted solid planes. It is shown that the low-frequency behavior of the combination design of embedded PEBG (EP-EBG) and shorting via arrays is quite different from that of traditional two-layer PEBG. Techniques for reducing the lower side cutoff frequency of EP-EBG in multiple plane pairs are then discussed and presented. Excellent simultaneous switching noise (SSN) suppression and signal integrity (SI) can be simultaneously achieved in two plane pairs of the multi-via mushroom EP-EBG structure. Both the simulated and measured results are given to validate the ideas.
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关键词
simultaneous switching noise (ssn),multiple plane,multilayer pcb,si,simultaneous switching noise,photonic band gap,planar electromagnetic band-gap (pebg),ssn suppression,printed circuits,shorting via arrays,shorted solid plane,embedded planar electromagnetic band-gap structure,interference suppression,signal integrity,shorting via array,multivia mushroom ep-ebg structure,metamaterials,cutoff frequency,noise,solids,silicon
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