Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings

J. H. Lee
J. H. Lee
T. H. Yoon
T. H. Yoon

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, pp. 1529-1543, 2002.

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Keywords:
epoxy molding compoundplasma polymer coatingadhesionCTEsilica filler

Abstract:

Silica for epoxy molding compounds (EMCs) was coated via plasma polymerization using an RF plasma (13.56 MHz) as a function of the plasma power, gas pressure, and treatment time. The monomers utilized for the plasma polymer coatings were 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allyl mercaptan, and allyl alcohol. The E...More

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