New anisothermal creep modelling for Cu-based shape memory alloys

Significant progresses were made these last years on the micromechanical modelling of the behaviour of Shape Memory Alloys (SMA). In spite of that, significant problems still remain without answer For example, for copper-based alloys, the superelastic effect modelling gives numerical results very close to the experimental results. Contrary, the modelling of the anisothermal creep at low stress level (in particular for stress lower than 100 MPa) does not give satisfactory results. The more the applied stress is weak, the more the number of activated variants is high. These variants gather around certain privileged poles to form groups known as accommodating groups composed of four variants.