Sub-100-nm current-perpendicular-to-plane sensor fabrication

Y. K. Zheng,K. B. Li,J. J. Qiu,G. C. Han,Z. B. Guo,B. Y. Zong,An L. h,P. Luo,Z. Y. Liu,Y. H. Wu

Magnetics, IEEE Transactions（2004）

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摘要

Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ion-milling, and wet etching for self-opening via-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm·0.05 μm to 0.4 μm· 0.5 μm with different free- layer structures have been investigated by means of the first method.

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关键词

giant magnetoresistance,magnetic sensors,perpendicular magnetic recording,spin valves,100 nm,CPP sensors,CPP spin valve films,cell patterning,current-perpendicular-to-plane sensor fabrication,free-layer structures,giant magnetoresistance effect,height difference,ion milling,ion-beam-deposition system,probe recording,recording heads,resist layer,self-opening via-hole,shunting effect,small dimension,via hole,wet etching,CPP,Current-perpendicular-to-plane,GMR,SV,effect,giant magnetoresistance,probe recording,spin-valve

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