Study of the Drain Leakage Current in Bottom-Gated Nanocrystalline Silicon Thin-Film Transistors by Conduction and Low-Frequency Noise Measurements

IEEE Transactions on Electron Devices(2007)

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摘要
The drain leakage current in n-channel bottom-gated nanocrystalline silicon (nc-Si) thin-film transistors is investigated systematically by conduction and low-frequency noise measurements. The presented results indicate that the leakage current, controlled by the reverse biased drain junction, is due to Poole-Frenkel emission at low electric fields and band-to-band tunneling at large electric fields. The leakage current is correlated with single-energy traps and deep grain boundary trap levels with a uniform energy distribution in the band gap of the nc-Si. Analysis of the leakage current noise spectra indicates that the grain boundary trap density of 8.5 X 10(12) cm(-2) in the upper part of the nc-Si film is reduced to 2.1 x 10(12) cm(-2) in the lower part of the film, which is attributed. to a contamination of the nc-Si bulk by oxygen.
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electric noise measurement,elemental semiconductors,leakage currents,nanostructured materials,semiconductor device measurement,semiconductor device noise,silicon,thin film transistors,Poole-Frenkel emission,Si,band-to-band tunneling,bottom-gated nanocrystalline silicon thin-film transistors,conduction measurement,deep grain boundary trap levels,drain leakage current,electric fields,grain boundary trap density,leakage current noise spectra,low-frequency noise measurement,nc-Si,reverse biased drain junction,single-energy traps,uniform energy distribution,Bottom-gated thin-film transistors (TFTs),leakage current,nanocrystalline silicon (nc-Si),noise
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