Influence and Mechanism of Pt Micro-Alloying on the Microstructure and Service Reliability of the Sn-9Zn-0.02Al/Cu Solder Joint: Combined Experimental and Theoretical Study
Engineering Failure Analysis（2025）
Abstract
Currently, significant attention is paid to improving the service reliability of Sn-Zn/Cu solder joints for electronic packaging. In this study, the service reliability of the Sn-9Zn-0.02Al/Cu solder joint was significantly improved by Pt micro-alloying. Our investigations revealed that the thickness of the Cu5Zn8 layer mainly depends on the amount of Zn that diffuses to the solder/Cu5Zn8 interface. The extreme imbalance in the diffusion of Zn and Cu at the interface leads to void formation at the solder joint, which changes the fracture mode of the joint from mixed ductile–brittle to brittle transgranular, deteriorating its service reliability. Pt micro-alloying reduces the interfacial stability of the solder by decreasing the ionic characteristics of the bonding at the Sn/Zn interface, thereby promoting the diffusion of Zn from the solder to solder/Cu5Zn8 interface. This increases the thickness of the Cu5Zn8 layer and compensates for the diffusion of Zn and Cu, inhibiting the formation of interfacial voids and decreasing the area of exposed Cu5Zn8 at the fracture surface. Therefore, Pt micro-alloying significantly improves the service reliability of the Sn-9Zn-0.02Al/Cu (SZA/Cu) solder joints by 39 % (the shear strength of the SZA-0.1Pt/Cu joint was 42.8 MPa after 240 h of aging at 160 ℃). However, excessive Pt micro-alloying leads to the formation of a Pt2Zn10.72 phase in the solder, hindering the diffusion of Zn and reducing the service reliability of the joint.
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Key words
Electronic engineering,Alloy,Copper/tin-based lead-free solder,Welding,Microscopic characterization and microanalysis,Degradation,Material defect,Pt micro-alloying
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