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    • Achieving Effective Bonding Between W-75Cu Composite and CuCrZr Alloy Via Spark Plasma Sintering

    Changcheng Sang,Dang Xu,Kaichao Fu,Ruizhi Chen,Pengqi Chen,Yingwei Lu,Yonghong Xia,Qiu Xu,Jigui Cheng

    FUSION ENGINEERING AND DESIGN（2025）

    Hefei Univ Technol

    Cited 0|Views8
    Abstract
    In this study, spark plasma sintering (SPS) was employed to achieve the simultaneous sintering and bonding of W-75Cu composite with CuCrZr alloy. The effects of the sintering temperature on the microstructure evolution and properties of the W-75Cu/CuCrZr joints were systematically investigated and their thermal shock resistance was evaluated. The results indicated that a dense and defect-free joint was obtained at 950 degrees C, demonstrating the maximum shear strength (216.5 MPa) and thermal conductivity (237.9 W/(m & sdot;K)). Fracture analysis revealed that failure predominantly occurred within the W-75Cu matrix, confirming robust interfacial bonding. Additionally, after 200 thermal shock cycles at 450 degrees C-RT, the W-75Cu/CuCrZr joint maintained a high joint strength (172.7 MPa) without visible cracks on the interface, thereby demonstrating excellent joint reliability and thermal shock resistance. This study highlights the advantages of SPS technology in promoting the densification of the matrices and achieving high-performance joints, providing valuable technical insights for achieving a reliable bonding between the W-Cu FGM (high Cu content) and the CuCrZr heat sink material.
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    Key words
    W-75Cu/CuCrZr joints,Spark plasma sintering,Mechanical properties,Thermal shock resistance
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