Accurate Electromagnetic Modeling for Multiscale Interconnect Structures Based on Volume-Surface Integral Equations
2023 Photonics & Electromagnetics Research Symposium (PIERS)（2023）
Key words
conducting part,electromagnetic modeling analysis,inhomogeneous substrate,method of moments,multiscale interconnect structures,penetrable substrate part,Rao-Wilton-Glisson basis function,Schaubert-Wilton-Glisson basis function,SIEs,VIEs,volume-surface integral equations,VSIEs
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