GaN damage-free cyclic etching by sequential exposure to Cl-2 plasma and Ar plasma with low Ar+-ion energy at substrate temperature of 400 degrees C

Damage-free atomic layer etching (ALE) of GaN was demonstrated using a cyclic process in which the chlorinated layer formed by Cl-2 plasma exposure was removed by exposure to Ar plasma with energy-controlled ions when the substrate temperature was maintained at 400 degrees C. The layer chlorinated at 400 degrees C by Cl2 plasma exposure was found to be thinner than that chlorinated at 25 degrees C. Therefore, in the case of an Ar+-ion energy of 70 eV, the "ALE synergy" parameter, which quantifies the degree to which a process approaches the ideal ALE regime, decreased from 86% at a substrate temperature of 25 degrees C to 24% at a substrate temperature of 400 degrees C. A substrate temperature of 400 degrees C promoted etching even at the lower ion energy of 40 eV, thereby resulting in a higher ALE synergy of 62%. The vertical etching profile with no degradation of photoluminescence near the band edge on the etched surface was then observed. The proposed high temperature ALE method is promising for realizing a vertical pattern profile via damage-free etching of GaN.