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    • Novel Interposer Scheme for 3D Integration

    C. T. Ko,W. C. Lo

    2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits（2015）

    Ind Technol Res Inst

    Cited 24|Views18
    Abstract
    Glass interposer is introduced as an alternative to silicon interposer for 3D integration due to the attractive advantages such as excellent electrical isolation, extremely low insertion loss, adjustable coefficient of thermal expansion (CTE), and most importantly low cost potential with the capability of large panel size fabrication. In this study, a novel scheme is proposed to fabricate glass interposer more cost-effectively. Thin glass with through-glass via (TGV) is adopted directly for interposer fabrication, which makes double-side traces and interconnect with panel-compatible laminated temporary bond and laser de-bond technologies. 100μm thickness, 200mm by 200mm small panel size glass interposer is successfully process integrated and demonstrated with the novel scheme. It provides a realizable low cost and panel-level fabricated glass interposer solution for 3D integration applications.
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    Key words
    interposer scheme,3D integration,glass interposer,electrical isolation,insertion loss,thermal expansion coefficient,through-glass via,interposer fabrication,panel-compatible laminated temporary bond,laser de-bond technologies,size 100 mum,size 200 mm,Si
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