Modeling and Analysis of Parasitic Inductance in TGVs Within High-Density Glass Interposers for High-Speed Interconnects

Jinxu Liu,Jihua Zhang, Zhen Fang, Shuqi Li, Zihan Wang, Ding Wen, Wenlei Li, Shan Li,Hongwei Chen,Libin Gao,Wanli Zhang

IEEE Transactions on Microwave Theory and Techniques（2025）

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Glass-based integration,high-density through-glass vias (TGVs),parasitic inductance

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