Evolution Mechanism of Copper Grains in Advanced Interconnect Processes

Yinuo Jin, Han Zhang, Changqing Zhu, Liang Du, Simian Zhang, Linbo Liu, Qixing Yu, Yu Yao,Rong Yu,Chen Wang

2025 Conference of Science and Technology of Integrated Circuits (CSTIC)（2025）

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关键词

Copper Grains,Precise Control,Device Performance,Grain Boundaries,Electroplating,Grain Growth,Density Control,Improve Device Performance,Boundary Forcing,Original Grain,Scanning Electron Microscopy,Nucleation,Energy-dispersive X-ray Spectroscopy,Grain Size,Vertical Direction,Bond Strength,Stress Distribution,High Current Density,Small Grains,Focused Ion Beam,Significant Changes In Size,Copper Film,Low Current Density,Plane Direction

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