订阅小程序
旧版功能

A High Efficiency Hybrid Modular Multilevel Converter with a SiC Device-Based External Shaping Module

IEEE Transactions on Power Electronics(2025)

引用 0|浏览1
关键词
Hybrid MMC,Si IGBT,SiC MOSFET,hybrid modulation,voltage balancing,efficiency optimization
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要