An Agile Additively Manufactured 5G/mm-Wave RF Front-End with Multilayer Conformality and Printed RF VIAs for Ultrawideband and Miniaturized Systems
IEEE Microwave and Wireless Technology Letters（2025）
Key words
Additive manufacturing (AM),bandpass,conformal,filter bank,inkjet-printing,mm-Wave,multilayer,RF vertical interconnects (VIA),RFIC switch,system-in-package (SiP),ultrawideband (UWB)
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