In-Depth DFT-Based Analysis of the Structural, Mechanical, Thermodynamic, and Electronic Characteristics of CuP2 and Cu3P: Insights into Material Stability and Performance
Metals（2025）
Key words
density functional theory,compounds,microelectronic packaging technologies,mechanical properties,thermodynamic properties,electronic properties
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined