A 200 °C SiC Phase-Leg Power Module with Integrated Gate Drivers: Development, Performance Assessment and Path Forward
IEEE Journal of Emerging and Selected Topics in Power Electronics（2025）
Key words
Silicon carbide,low temperature co-fired ceramic,gate driver,power module packaging,high-temperature applications
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined