Bias Temperature Instability Analysis of Oxide Power Transistors for BEOL On-chip Voltage Converter in Thermally-Constrained H3D Systems
2024 IEEE International Electron Devices Meeting (IEDM)（2024）
Key words
Power Devices,Powerful Oxidant,Heterogeneous 3D,Bias Temperature Instability,Thermal Analysis,Peak Temperature,Field-effect Transistors,Thermal Management,Dcdc Converter,Voltage Ripple,Thermal Simulation,SPICE Simulations,Voltage Drop,Power Delivery,Converter Output,Converter Output Voltage,Thermal Challenge,Heat Spreader
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