Substrate-less Power Semiconductor Packaging for the Potential of Recyclability

Jinxiao Wei, Jinpeng Cheng, Student Yuxiang Chen,Li Ran, Hao Feng,Homer Alan Mantooth,Frede Blaabjerg, Xu Zhang,Sudharsan Chinnaiyan, Student Philip A. Mawby

IEEE Journal of Emerging and Selected Topics in Power Electronics（2025）

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Key words

Power semiconductor device,packaging,integrated cooling,electric insulation,recyclability,heat pipe

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