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Fabrication of Uniform Submicron Metal Bump Arrays Based on Undercut Sacrificial Layer for Lift-Off Process

Zelei Lai, Zhenyou Zou, Jinyu Ye, Yibin Lin,Xiongtu Zhou,Jie Sun,Tailiang Guo,Chaoxing Wu,Qun Yan,Lei Sun,Yongai Zhang

Journal of Materials Science Materials in Electronics（2025）

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