Theoretical Screening and Experimental Fabrication of Metallized Layer for Enhanced Cu Wetting and Adhesion on Si3N4 Substrate
Ceramics International(2025)
关键词
Computational screening,Metallized layer,Si3N4 copper-clad laminate,Interfacial binding,Surface conductivity
AI 理解论文
溯源树
样例

生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要