Soft Elastic, Thermally Conductive, Electrically Insulating H-Bn@egain/ecoflex Composites As Encapsulation and Thermal Interface Materials Applicated in Wearable Electronics

Qi-Qi Fu,Zijian An, Ailing Dong, Shenglin Zhang, Weixin Zhou, Ruoning Chu, Yizhou Qi,Jun Ai,Qingjun Liu

ADVANCED MATERIALS TECHNOLOGIES（2024）

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functional nanocomposites,thermal interface material,thermal management,wearable electronics

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