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Achieving Both Low Lattice Thermal Conductivity and High Hardness by the Design of Bonding Structure

Hongquan Liu,Xuye Xin, Jun Ma,Yijie Gu,Xiaoming Xu,Haifeng Wang, Yanfang Wang, Hongtao Zhang

CERAMICS INTERNATIONAL（2025）

Cited 0|Views7
Key words
Soft bonds,-pCOHP,Skeleton structure,Lattice thermal conductivity,Hardness
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