Fabrication of Wafer-Level Vacuum-Packaged 3C-Sic Resonant Microstructures Grown on <111> and <100> SiliconSergio Sapienza,Luca Belsito,M. Ferri,Ivan Elmi,Marcin Zieliński,Francesco La Via,Alberto RoncagliaKey engineering materials（2024）引用 0|浏览3AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
