Three-Dimensional Electro-Thermal Coupling Temperature Evaluation Modeling of Wire-Bonded Power Chips under Surge Conditions
IEEE TRANSACTIONS ON POWER ELECTRONICS（2025）
Key words
Surges,Temperature measurement,Temperature distribution,Packaging,Computational modeling,Wires,Semiconductor device measurement,Bonding,Transient analysis,Solid modeling,Electro-thermal model,surge condition,temperature distribution
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