A Multiscale Simulation Approach for Program Noise and Cross-temperature Effects in 3D NANDs

Keng-Hua Lin,Salvatore Maria Amoroso, Po-Chou Chen, Yueh-Ying Tseng,Andrew R. Brown,Plamen Asenov, U. G. Vej-Hansen,Xi-Wei Lin,Anders Blom,Victor Moroz, Chih-Chiang Wang

2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)（2024）

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3D NAND,Memories,Ab-initio simulation,TCAD,Variability,Reliability

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