An Electro-Thermo-mechanical Coupling Phase-Field Model of Defect Evolution Induced by Electromigration in Interconnects
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES（2025）
关键词
Electromigration,Interconnects,Void evolution,Phase-field method,Thermomigration,"Current crowding" effect
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要