The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)（2024）
关键词
ML,Thermal modelling,SiC,power module
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要