Low-Temperature Photo Imageable Dielectric for Redistribution Layers in Advanced Packaging Application
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING（2025）
Key words
Low-temperature photo imageable dielectric (LT-PID),Redistribution layers (RDLs),High-performance computing (HPC)
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined