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Failure Mechanisms Investigation of Through Glass Via (TGV) under Thermal Annealing and Shock

Haozhong Wang, Chunchao Lai, Bingxu Ma,Xiaodong Jian,Si Chen,Hongtao Chen, Laiwang Fang,Xiaofeng Yang

2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2024）

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Key words
2.5D Packaging,Through glass via (TGV),Interposer,Finite Element Analysis,Reliability
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