Study on the Failure of the Middle Solder Joints of the Large-Size FCBGA
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2024）
Key words
FCBGA,finite element analysis,solder joints,warpage
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined