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Microstructural Development, Deformation Behavior, and Texture Evolution Investigation During Hot Compression of a Dynamically Recrystallized Ti-5Cu Alloy in the Dual (α + Β) Phase Region

Solomon Kerealme Yeshanew,Chunguang Bai, Qing Jia,Tong Xi,Zhiqiang Zhang,Diaofeng Li,Nan Li,Rui Yang,Ke Yang

Journal of Materials Engineering and Performance（2024）

Cited 0|Views6
Key words
grain boundaries,microstructure evolution,recrystallization process,texture development,Ti-5Cu alloy
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