Synergistic Effect of Cta+ and Br- on Defect-Free Tsv Filling by Cu Electrodeposition
Electrochimica Acta（2024）
关键词
Cu electrodeposition,Through-silicon via,Bottom-up filling,Cetyltrimethylammonium cation,Bromide ion
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要