3D Co-packaging of GaN/SiC Cascode Device for High-Frequency Power Switching Operation
2024 36TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC S, ISPSD 2024（2024）
Key words
GaN HEMT,SiC JFET,Cascode device,3D co-package
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined