Investigation on the Root Cause of ESD Failure of Large Size WBBGA Package Chip
CONFERENCE OF SCIENCE & TECHNOLOGY FOR INTEGRATED CIRCUITS, 2024 CSTIC（2024）
Key words
Electrostatic Discharge,Electrostatic Discharge Failure,Hot Spots,Results Of This Paper,Testing Process,Design Flaws,Internal Performance,Internal Circuit,Current Limitations,I-V Curves,Threshold Voltage,Functional Failure,Design Perspective,Failure Analysis,Overvoltage,Digital Domain,Voltage Scan,Digital Power
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