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A Modularized Thermal Test Chip Design and Verification

Jianjun Sun, Deping Wang, Shiying Zhou,Bin Yan,Yelei Xie,Jian Pang, Guangyao Li,Keqing Ouyang

CONFERENCE OF SCIENCE & TECHNOLOGY FOR INTEGRATED CIRCUITS, 2024 CSTIC(2024)

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Key words
Thermal test chip,Power map,Temperature mapping,Thermal evaluation,Thermal interface material
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