Analysis of the Capacity and Energy Efficiency of Metallodielectric Surface Wave Links Operating Beyond Y Band

The ability to reconfigure surface wave links has the potential to mitigate manufacturing issues unavoidable on microtextured surfaces as well as to introduce some level of signal processing. To this end, this work proposes a surface wave link based on a silicon-aluminium periodic structure supporting surface waves in the THz range. The dispersion and power budget of a link based on such surface wave supporting metallodielectric structure is presented. This work provides an effective guide for the layout of terahertz surface wave links for on-chip communications.