Thermal Contact Resistance of the Copper–Copper Pair with Graphene Thermal Interface in Magnetic Fields up to 10 T

Abstract— The thermal contact resistance of a detachable connection in copper-copper contact pair with a thermal interface from layers of graphene synthesized by the method of a low pressure chemical vapor deposi-tion on the contact surface was studied. Obtaining the value of the thermal contact resistance of a detachable contact pair copper–graphene–copper by the method of transient heat flow, at a temperature of 15–150 K under the influence of an external magnetic field up to 10 T.