Growth mechanism of intermetallic compound in SnAg/Cu interface of micro-bumps under extremely low-temperature by phase field methodShuai Zhang, Yuanfan Chu,Liqiang Cao,Kyung-Wook Paik,Peng He,Shuye ZhangMaterials Characterization（2024）引用 0|浏览0暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
