A Digital Image Correlation Study on the Microstructure and Strain Behavior of Electroplated Nanotwinned Copper As Interconnection Material
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2023）
关键词
Redistribution Layer (RDL),Nanotwinned Copper (nt-Cu),Digital Image Correlation (DIC),Microstructure,Strain Distribution
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