A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications

Zhiyang Shen, Hongfeng Zhang,Amos Nkansah, Jiajia Chen,Jin Chen,Johan Liu

2023 24th International Conference on Electronic Packaging Technology (ICEPT)(2023)

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摘要
As the most effective heat transfer device, heat pipes have received widespread attention, but traditional heat pipes may be difficult to meet heat dissipation requirements in the near future. Since graphene was discovered, its ultra-high thermal conductivity has been the focus of people's research and application. Therefore, the combination of graphene and heat pipes is a method to improve the performance of existing heat pipes. This paper is a critical assessment of recent advances in graphene-based heat pipes. In the paper, we conducted a simple theoretical analysis of the operation of the heat pipe, and also summarized the research status, enhancement mechanism, and enhancement method of graphene-enhanced heat pipes, and predicted the future development direction. The results show that depositing graphene-based materials on wicks, using graphene-based nanofluids, and application of graphene composites are effective ways to enhance the performance of heat pipes.
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关键词
heat pipe,wick,nanofluid,thermal performance
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