Laser Annealed Two Dimensional SiO2/Si1-xGex Scaffolds for Nanoscaled Devices, Synergy of Experiment and Computation

Ultraviolet nanosecond laser annealing (UV-NLA) proves to be an important technique, particularly when tightly controlled heating and melting are necessary. In the realm of semiconductor technologies, the significance of laser annealing (NLA) grows in tandem with the escalating intricacy of integration schemes in nano-scaled devices. Silicon-germanium alloys have been studied for decades for their compatibility with silicon devices. Indeed, they enable the manipulation of properties like strain, carrier mobilities and bandgap. Laser melting on such type of layers, however results, up to now, in the development of extended defects and poor control over layer morphology. In our study, we investigate the laser melting of  700 nm thick relaxed silicon-germanium samples coated with SiO2 nano-arrays, achieving a precise control of the melting process, without observing the formation of extended defects at the interface left by the liquid front. We found the geometrical parameters of the silicon oxide having an impact on the thermal budget samples see, influencing melt threshold, melt depth and germanium distribution.