Enhanced Thermal and Mechanical Performance in Insulated Aramid/Functionalized Graphene Composite
IEEE Transactions on Dielectrics and Electrical Insulation(2024)
关键词
Graphene,Conductivity,Heat sinks,Insulation,Interconnected systems,Dielectrics and electrical insulation,Thermal stability,Functionalized graphene,mechanical performance,molecular dynamics,poly-(meta-phenylene isophthalamide) (PMIA),thermal properties
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