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Gamma-Ray Irradiation Induced Dielectric Loss of SiO2/Si Heterostructures in Through-Silicon Vias (tsvs) by Forming Border Traps

Guanghui Zhang,Zenghui Yang,Xiaoshi Li,Shuairong Deng,Yang Liu,Hang Zhou, Maoyang Peng,Zhengping Fu,Rui Chen,Dechao Meng,Le Zhong,Quanfeng Zhou,Su-Huai Wei

ACS APPLIED ELECTRONIC MATERIALS（2024）

Cited 27|Views33
Key words
gamma-ray irradiation,material defect,through-siliconvia (TSV),dielectric loss,interfacial relaxation,DLTS
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