Fluid characteristics and polishing experiment of inclined hole array using abrasive water flow

Lijun Xiao, Yangyang Tang,Zhuang Liu,Changshui Gao, Chao Sheng

SURFACE REVIEW AND LETTERS(2024)

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摘要
Inclined hole arrays on superalloys have important applications in aeroengines. However, defects occur during fabrication of inclined holes using thermal drilling methods, i.e. electrical discharge drilling (EDD), including a recast layer and microcracks on the hole wall. Therefore, abrasive water flow polishing (AWFP) of a superalloy inclined hole array machined via EDD was investigated in this study. Two types of specimens were designed: a hole array of identical size and a hole array with an identical inclination angle. The fluid simulation revealed that the fluid velocity and pressure on the lower edge of the inclined hole were significantly higher than those on the upper edge when the fluid flowed forward. The fluid characteristics exhibited opposite trends when backward flow was implemented. Time-division bidirectional flow can effectively compensate for flow field nonuniformity and improve material removal consistency during polishing. The experimental results show that for inclined holes with identical inclination angles, the size expansion decreases with an increase in the hole diameter owing to the lower fluid velocity and material removal volume in the relatively larger holes. Consequently, surface roughness Ra increases with hole size. For inclined holes with identical diameters, the size expansions of the entrance and exit approach the same level; whereas, Ra decreased with an increase in the inclination angle. The hole taper slightly reduced in all cases. Using garnet abrasives with 1300 mesh size, 1.5 wt.% abrasive concentration, and 3 MPa fluid pressure, the surface roughness Ra of target holes was reduced from pre-polishing >= 5.0 mu m to approximately post-polishing 1.0 mu m. The recast layer on the hole wall caused by EDD was completely removed.
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关键词
Abrasive water flow polishing,inclined hole array,flow field characters,time-division bidirectional polishing,surface roughness
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